Antistatic hard coat film

ABSTRACT

An antistatic hard coat film for various displays is provided which can prevent electrostatic deposition of foreign materials and at the same time possesses excellent scratch resistance and hardness high enough not to cause a deterioration in transparency upon being rubbed. The antistatic hard coat film  5  comprises: a transparent substrate film  1;  a transparent conductive layer  2,  having a surface resistivity of preferably not more than 10 12  Ω/□, provided on the substrate film  1;  and a hard coat  3  provided on the transparent conductive layer  2,  the hard coat  3  preferably having such an anisotropic conductivity that the resistivity in the layer surface direction is higher than the resistivity in the layer thickness direction.

This is a continuation of application Ser. No. 09/083,428 filed May 21,1998, issued as U.S. Pat. No. 6,146,753.

BACKGROUND OF THE INVENTION

The present invention relates to a dust-proof, scratch-resistant film.More particularly, the present invention relates to a transparent filmthat is excellent in prevention of soiling created by deposition ofdust, on the surface of various displays of word processors, computers,and televisions, surfaces of polarizing plates used in liquid crystaldisplays, optical lenses, such as sunglass lenses of transparentplastics, lenses of eyeglasses, finder lenses for cameras, covers forvarious instruments, and surfaces of window glasses of automobiles andelectric rail cars, and at the same time possesses excellent scratchresistance.

Glass plates and transparent resin plates, such as transparent plasticplates, are used in curve mirrors, back mirrors, goggles, and windowglasses, particularly displays of electronic equipment, such as personalcomputers and word processors, and other various commercial displays.These resin plates, as compared with the glass plates, are lightweightand less likely to be broken, but on the other hand, they aredisadvantageous in that dust is electrostatically deposited on thesurface thereof and, in addition, the hardness is so low that thescratch resistance is poor and, hence, a scratch is createddeteriorating the transparency.

Conventional methods for preventing the electrostatic deposition of dustand the deterioration in transparency created by scratching upon beingrubbed include coating of an antistatic paint on the surface of theplastic and formation of a hard coat on the surface of the plastic.

The hard coat with a conductive material, such as an antistatic agent,being dispersed in an amount large enough to prevent the deposition offoreign materials, however, has unsatisfactory transparency and isfurther disadvantageous in that curing is inhibited making it impossibleto provide hardness high enough to meet the scratch resistancerequirement.

A highly transparent conductive thin film can be formed by vapordeposition of a metal oxide or the like. The process of vapordeposition, however, is inefficient to cause increased cost and has anadditional disadvantage that the scratch resistance of the formed thinfilm is unsatisfactory.

DISCLOSURE OF THE INVENTION

Accordingly, an object of the present invention is to provide anantistatic hard coat film that, when used in various displays forobserving visual information, such as an object, a letter, or a figure,through a transparent substrate, or used in mirrors for observing animage from a reflective layer through a transparent substrate, canprevent electrostatic deposition of foreign materials on the surface ofthe transparent substrate and at the same time has hardness high enoughnot to cause a deterioration in transparency due to a scratch or thelike upon being rubbed.

The hard coat film according to the present invention can maintain thetransparency on such a level as will not cause a problem associated withthe perception of an image seen through the film.

In order to solve the above problems, the present invention provides anantistatic hard coat film comprising: a transparent substrate film; atransparent conductive layer provided on the substrate film; and a hardcoat layer provided on the transparent conductive layer.

According to a preferred embodiment of the present invention, thetransparent conductive layer has a surface resistivity of not more than10¹² Ω/□.

Further, according to a preferred embodiment of the present invention,the hard coat layer has a volume resistivity in the thickness directionof not more than 10⁸ Ω·cm.

According to another preferred embodiment of the present invention, thehard coat layer comprises a reaction-curing resin composition and has athickness of 1 to 50 μm.

Further, according to another preferred embodiment of the presentinvention, the hard coat layer comprises an anisotropic conductive hardcoat layer having a higher volume resistivity in the layer surfacedirection and a lower volume resistivity in the layer thicknessdirection.

Preferably, the anisotropic conductive layer comprises a hard coat resincomprising conductive fine particles, the diameter of the conductivefine particles being not less than one-third of the coating thickness ofthe anisotropic conductive layer.

Further, preferably, the conductive fine particles are particles whichhave been surface treated with gold and/or nickel.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view showing a fundamentalconstruction of the antistatic hard coat film according to the presentinvention;

FIG. 2 is a schematic cross-sectional view showing an antistatic hardcoat film according to an embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view showing an antistatic hardcoat film according to another embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view of an antistatic hard coatfilm having surface irregularities according to an embodiment of thepresent invention;

FIG. 5 is a schematic cross-sectional view of an antistatic hard coatfilm having a matted surface according to an embodiment of the presentinvention;

FIG. 6 is a schematic cross-sectional view of a comparative hard coatfilm;

FIG. 7 is a schematic cross-sectional view of a comparative antistatichard coat film;

FIG. 8 is a schematic cross-sectional view of another comparativeantistatic hard coat film; and

FIG. 9 is a schematic cross-sectional view of a further comparativeantistatic hard coat film.

BEST MODE FOR CARRYING OUT THE INVENTION

As shown in FIG. 1, the antistatic hard coat film of the presentinvention is an antistatic hard coat film 5 comprising: a transparentsubstrate film 1; a transparent conductive layer 2 provided on thesubstrate film; and a hard coat 3 provided on the transparent conductivelayer.

Preferably, the surface resistivity of the transparent conductive layer2 is not more than 10¹² Ω/□, more preferably not more than 10⁸ Ω/□.

Further, the volume resistivity in the thickness direction of the hardcoat 3 is preferably not more than 10⁸ Ω·cm, preferably not more than10³ Ω·cm.

Furthermore, preferably, the hard coat 3 comprises a reaction-curingresin composition and has a thickness of 1 to 50 μm.

As shown in FIG. 2, preferably, the hard coat 3 is constituted by ananisotropic conductive hard coat 31 having a higher volume resistivityin the layer surface direction and a lower volume resistivity in thelayer thickness direction.

Further, preferably, the anisotropic conductive hard coat 3 comprises ahard coat resin comprising conductive fine particles 4, the diameter ofthe conductive fine particles being not less than one-third of thecoating thickness of the anisotropic conductive layer.

In this case, the conductive fine particles 4 are preferably particlesthat have been surface treated with gold and/or nickel. Preferably, theparticles in this case are selected from the group consisting of silica,carbon black, metallic, and resin particles.

The transparent substrate film according to the present invention ispreferably constituted by a stretched or unstretched film of athermoplastic resin, such as cellulose triacetate, polyester, polyamide,polyimide, polypropylene, polymethylpentene, polyvinyl chloride,polyvinyl acetal, methyl polymethacrylate, polycarbonate, orpolyurethane.

A conductive layer comprising conductive fine particles and areaction-curing resin composition may be coated on the transparentsubstrate film. Alternatively, a metal oxide or the like may be formedon the transparent substrate film by a conventional method, such asvapor deposition or sputtering. The conductive layer may be formed onthe substrate film either directly or through a primer layer that canenhance the bonding.

The coating may be performed by a conventional method selected from rollcoating, gravure coating, bar coating, extrusion coating and the likeaccording to the properties and coverage of the coating composition.

Conductive fine particles which may be preferably used in the conductivelayer according to the present invention include fine particles ofantimony-doped indium-tin oxide (hereinafter referred to as “ATO”) andindium-tin oxide (ITO).

A conductive thin film formed by vapor deposition or sputtering of atransparent metal or metal oxide may constitute the conductive layer.

Preferably, the reaction-curing resin composition for constituting theconductive layer is selected from those that have good adhesion to thesubstrate film, are lightfast and moisturefast as a resin composition,and have good adhesion to an anisotropic conductive layer provided onthe conductive layer.

The anisotropic conductivity referred to in the present invention meansthat, as given in the following formula, the volume resistivity in thelayer surface direction (P_(VH)) is at least ten times larger than thevolume resistivity in the layer thickness direction (P_(VV)):

P _(VH)≧10×P _(VV)

When the above relationship is not satisfied, it cannot be generallysaid that the conductive layer has anisotropic conductivity.

Preferred examples of the conductive thin layer provided by vapordeposition or sputtering include those of ITO, ATO, gold, nickel, andzinc oxide/aluminum oxide. Preferred examples of the conductive layerwhich may be provided by coating include those of polypyrrole andpolyaniline.

Preferably, the resin composition for constituting the conductive layeraccording to the present invention comprises an alkyd resin, an oligomeror a prepolymer of an (meth)acrylate (the term “(meth)acrylate” usedtherein referring to both acrylate and methacrylate) of a polyfunctionalcompound such as a polyhydric alcohol, and a relatively large amount ofa reactive diluent. Diluents usable herein include: monofunctionalmonomers, such as ethyl (meth)acrylate, ethylhexyl (meth)acrylate,styrene, vinyltoluene, and N-vinylpyrrolidone; and polyfunctionalmonomers, for example, trimethylolpropane tri(meth)acrylate, hexanediol(meth)acrylate, tripropylene glycol di(meth)acrylate, diethylene glycoldi(meth) acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritolhexa(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and neopentylglycol di(meth)acrylate. When use of the above ionizing radiation curingresin as an ultraviolet curing resin is contemplated, aphotopolymerization initiator, such as an acetophenone, a benzophenone,Michler's benzoyl benzoate, α-amyloxime ester, or a thioxanthone, or aphotosensitizer, such as n-butylamine, triethylamine, ortri-n-butylphosphine, are incorporated into the resin composition.

The ionizing radiation curing resin may contain the following reactiveorganosilicon compound.

The reactive organosilicon compound is a compound represented by theformula RmSi(OR′)n wherein R and R′ represent an alkyl group having 1 to10 carbon atoms and m and n are each an integer, provided that m+n=4.More specific examples of the reactive organosilicon compound includetetramethoxysilane, tetraethoxysilane, tetra-iso-propoxysilane,tetra-n-propoxysilane, tetra-n-butoxysilane, tetra-sec-butoxysilane,tetra-tert-butoxysilane, tetrapentaethoxysilane,tetrapenta-iso-propoxysilane, tetrapenta-n-propoxysilane,tetrapenta-n-butoxysilane, tetrapenta-sec-butoxysilane,tetrapenta-tert-butoxysilane, methyltrimethoxysilane,methyltriethoxysilane, methyltripropoxysilane, methyltributoxysilane,dimethyldimethoxysilane, dimethyldiethoxysilane, dimethylethoxysilane,dimethylmethoxysilane, dimethylpropoxysilane, dimethylethoxysilane,dimethylmethoxysilane, dimethylpropoxysilane, dimethylbutoxysilane,methyldimethoxysilane, methyldiethoxysilane, and hexyltrimethoxysilane

The thickness of the conductive layer formed by coating is preferably0.5 to 5 μm, more preferably not less than 1 μm (the coverage in thepresent specification being expressed in terms of weight basis; the sameshall apply hereinafter). When the thickness is less than 0.5 μm, it isdifficult to bring the surface resistivity of the conductive layerformed on the transparent substrate film to not more than 10¹² Ω/□. Onthe other hand, when the thickness is more than 5 μm, the transparencyof the conductive layer is in some cases unfavorably lowered.

In the present invention, as described above, the surface resistivity ofthe transparent conductive layer is preferably not more than 10¹² Ω/□,more preferably not more than 10⁸ Ω/□. When the surface resistivity ofthe transparent conductive layer exceeds 10¹² Ω/□, good antistaticeffect cannot be unfavorably developed.

The hard coat layer according to the present invention is preferablyconstituted by an anisotropic conductive layer. The anisotropicconductive layer is a layer, coated on the conductive layer, that hashardness high enough to provide excellent scratch resistance and doesnot extremely deteriorate the conductivity.

The reaction-curing resin composition for the anisotropic conductivehard coat may be one that can be strongly adhered to the conductivelayer. In this case, in order to change the surface gloss or to enhancethe scratch resistance, the surface may be shaped in a period betweenafter coating and before curing, or alternatively, a lubricant may beadded to the resin composition.

Conductive fine particles used in the anisotropic conductive layer areselected from those of which the diameter is preferably not less thanone-third, more preferably half to twice, the coating thickness of thehard coat so that the hard coat layer has anisotropic conductivity.

When the diameter of the conductive particles is less than one-third ofthe thickness of the hard coat layer, anisotropic conductivity is notdeveloped in the hard coat layer, unfavorably resulting inunsatisfactory antistatic properties.

The volume resistivity in the thickness direction of the hard coat layeris preferably not more than 10⁸ Ω·cm, more preferably not more than 10³Ω·cm. When the volume resistivity exceeds 10⁸ Ω·cm, good antistaticproperties cannot be unfavorably provided.

Conductive fine particles used in the anisotropic conductive layer areparticularly preferably resin particles that have been surface treatedwith gold and/or nickel.

The following examples further illustrate the present invention.

EXAMPLE 1

Shintron C-4456-S7 (a tradename of a hard coating agent (solid content45%) with ATO dispersed therein, manufactured by Shinto Paint Co., Ltd.)was coated on one side of a 188 μm-thick polyester film A-4350(substrate film 1, manufactured by Toyobo Co., Ltd.). The coating wasdried and then cured by irradiation with ultraviolet light to form a 1μm-thick conductive layer 2. PET-D31 (a tradename of a hard coatingagent, manufactured by Dainichiseika Color & Chemicals Manufacturing.Co., Ltd.) was diluted with toluene and then coated on the conducivelayer 2, and the coating was then dried. The dried coating was cured byirradiation with an ionizing radiation to form a 7.5 μm-thick hard coat3. Thus, an antistatic hard coat film 5 of Example 1 shown in FIG. 1 wasprepared which comprised a substrate film 1 and two layers, a conductivelayer 2 and a hard coat 3, provided on the substrate film 1.

EXAMPLE 2

As shown in FIG. 2, Shintron C-4456-S7 as used in Example 1 was coatedon one side of a polyester film A-4350 (a substrate film 1) as used inExample 1, and the coating was dried and then cured by irradiation withultraviolet light to form a 1 μm-thick conducive layer 2. Subsequently,Bright 20GNR4,6-EH (a trade name of conductive fine particles 4comprising resin particles (benzoguanamine) having an average particlediameter of 5 pm which have been surface treated with gold and nickel,manufactured by Nippon Chemical Industrial Co., Ltd.) was dispersed inan amount of 0.1% by weight in PET-D31 as used in Example 1, and thedispersion was diluted with toluene to prepare a coating liquid. Thecoating liquid was coated on the conductive layer 2, and the coating wasdried and then cured by irradiation with an ionizing radiation to form a7.5 μm-thick anisotropic conductive hard coat 31. Thus, an antistatichard coat film 5 of Example 2 shown in FIG. 2 was prepared whichcomprised a substrate film 1 and two layers, a conductive layer 2 and ananisotropic conductive hard coat 31, provided on the substrate film 1.

EXAMPLE 3

The procedure of Example 2 was repeated, except that a conductive thinlayer 22 was formed by sputtering of ITO on the same substrate film 1 asused in Example 1 under the following conditions. Thus, an antistatichard coat film of Example 3 shown in FIG. 3 was prepared which compriseda substrate film 1 and two layers, a conductive thin layer 22 and ananisotropic conductive hard coat 31, provided on the substrate film 1.

Conditions for formation of conductive layer: sputtering of ITO

Degree of vacuum: 5×10⁻⁶ Torr, substrate temp.: room temp., argon gasintroduction rate: 100 scc/min, oxygen introduction rate: 5 cc/min,deposition rate: 1.6 Å, and thickness of ITO: 105 nm.

EXAMPLE 4

As shown in FIG. 4, Shintron C-4456-S7 as used in Example 1 was coatedon one side of a polyester film A-4350 (a substrate film 1) as used inExample 1, and the coating was dried and then cured by irradiation withultraviolet light to form a 1 μm-thick conducive layer 2. Subsequently,Bright 20GNR4,6-EH as used in Example 2 was dispersed in an amount of0.1% by weight in PET-D31 as used in Example 1, and the dispersion wasdiluted with toluene to prepare a coating liquid. The coating liquid wascoated on the conductive layer 2. PTH-25 (a trade name of a shapingfilm, manufactured by Unitika Ltd.) (not shown) was laminated on thecoating, the coating was cured by irradiation with an ionizingradiation, and the shaping film was then separated and removed to form a7.5 μm-thick anisotropic conductive hard coat 32 having surfaceirregularities. Thus, an antistatic hard coat film 5 of Example 4 shownin FIG. 4 was prepared which comprised a substrate film 1 and twolayers, a conductive layer 2 and an anisotropic conductive hard coat 32having surface irregularities, provided on the substrate film 1.

EXAMPLE 5

As shown in FIG. 5, Shintron C-4456-S7 as used in Example 1 was coatedon one side of a polyester film A-4350 (a substrate film 1) as used inExample 1, and the coating was dried and then cured by irradiation withultraviolet light to form a 1 μm-thick conducive layer 2. Subsequently,a matte conductive coating liquid having the following composition wascoated on the conductive layer 2, and the coating was dried and thencured by irradiation with an ionizing radiation to form a 7.5 μm-thickmatted, anisotropic conductive hard coat 33 on the conductive layer 2.Thus, an antistatic hard coat film 5 of Example 5 shown in FIG. 5 wasprepared which comprised a substrate film 1 and two layers, a conductivelayer 2 and a matted, anisotropic conductive hard coat 33, provided onthe substrate film 1.

Composition of matte, conductive coating liquid (solid content ratio):

Silica 3 parts by weight (average particle diameter 1.5 μm) Bright20GNR4, 6-EH 0.1 part by weight (conductive fine particles) Seika BeamEXG 40-77 (S-2) 100 parts by weight (Seika Beam (tradename): ionizingradiation curing resin, manufactured by Dainichiseika Color & ChemicalsManufacturing. Co., Ltd.)

EXAMPLE 6

Bright GNC-Gr (a trade name of conductive fine particles 4 comprisingcarbon particles having an average particle diameter of 12 μm which havebeen surface treated with gold and nickel, manufactured by NipponChemical Industrial Co., Ltd.) was dispersed in an amount of 0.1% byweight in PET-D31, and the dispersion was diluted with toluene toprepare a coating liquid. The coating liquid was coated on a conductivelayer 2 formed in the same manner as in Example 2, and the coating wasdried and then cured by irradiation with an ionizing radiation to form a12 μm-thick anisotropic conductive hard coat 31. Thus, an antistatichard coat film 5 of Example 6 shown in FIG. 2 was prepared whichcomprised a substrate film 1 and two layers, a conductive layer 2 and ananisotropic conductive hard coat 31, provided on the substrate film 1.

EXAMPLE 7

Bright 6GNM5-Ni (a trade name of conductive fine particles 4 comprisingnickel particles having an average particle diameter of 7 μm which havebeen surface treated with gold, manufactured by Nippon ChemicalIndustrial Co., Ltd.) was dispersed in an amount of 0.1% by weight inPET-D31, and the dispersion was diluted with toluene to prepare acoating liquid. The coating liquid was coated on a conductive layer 2formed in the same manner as in Example 2, and the coating was dried andthen cured by irradiation with an ionizing radiation to form an 8μm-thick anisotropic conductive hard coat 31. Thus, an antistatic hardcoat film 5 of Example 7 shown in FIG. 2 was prepared which comprised asubstrate film 1 and two layers, a conductive layer 2 and an anisotropicconductive hard coat 31, provided on the substrate film 1.

Comparative Example 1

A hard coating agent (PET-D31) as used in Example 1 was diluted withtoluene to prepare a coating liquid which was then coated on one side ofa polyester film A-4350 (a substrate film 1) as used in Example 1. Thecoating was dried and then cured by irradiation with an ionizingradiation. Thus, a hard coat film 6 of Comparative Example 1 shown inFIG. 6 was prepared which comprised a substrate film 1 having thereon asingle layer, that is, a 7.5 μm-thick hard coat 3.

Comparative Example 2

Shintron C-4456-S7 as used in Example 1 was coated on one side of apolyester film A-4350 (a substrate film 1) as used in Example 1. Thecoating was dried and then cured by irradiation with ultraviolet light.Thus, a hard coat film 6 of Comparative Example 2 shown in FIG. 7 wasprepared which comprised a substrate film 1 having thereon only a 7.5μm-thick conductive hard coat 21.

Comparative Example 3

A hard coating agent PET-D31 was diluted with toluene to prepare acoating liquid which was then coated on one side of a polyester filmA-4350 (a substrate film 1) as used in Example 1. The coating was driedand then cured by irradiation with an ionizing radiation to form a 7.5μm-thick hard coat 3. Further, Shintron C-4456-S7 as used in Example 1was coated on the hard coat 3, and the coating was dried and then curedby irradiation with ultraviolet light to form a 1 μm-thick conductivelayer 21. Thus, a hard coat film 6 of Comparative Example 3 shown inFIG. 8 was prepared.

Comparative Example 4

Shintron C-4456-S7 was coated on one side of a polyester film A-4350 (asubstrate film 1) as used in Example 1 in the same manner as in Example1, and the coating was dried and then cured by irradiation withultraviolet light to form a 1 μm-thick conducive layer 2. Subsequently,Bright 20GNR4,6-EH as used in Example 2 was dispersed in an amount of0.1% by weight in PET-D31, and the dispersion was diluted with tolueneto prepare a coating liquid. The coating liquid was gravure-coated onthe conductive layer 2, and the coating was dried and then cured byirradiation with an ionizing radiation to form a 16 μm-thick anisotropicconductive hard coat. Thus, an antistatic hard coat film 6 ofComparative Example 4 shown in FIG. 9 was prepared which comprised asubstrate film 1 and two layers, a conductive layer 2 and an anisotropicconductive hard coat 34, provided on the substrate film 1.

The samples of the examples and the comparative examples were evaluatedfor the following items, and the results are summarized in Table 1.

Total Light Transmittance of Laminate

The total light transmittance was measured with “ReflectionTransmissometer HR-100,” manufactured by Murakami Color ResearchLaboratory. In this case, 1st layer represents the measured value forthe layer coated directly on the substrate film, 2nd layer representsthe measured value for the hard coat film provided on the 1st layer, and2nd layer* represents the measured value for the case where only the 2ndlayer was coated directly on the substrate film.

Pencil Hardness

MITSUBISHI UNI 2H was reciprocated five strokes on the sample using a“simplified pencil scratch tester,” manufactured by Takuma Seiko Co.,Ltd. under conditions of load 1 kg and 10 mm. The sample was thenvisually inspected for a scratch. The number of strokes, in which thescratch was not created, was determined to evaluate the pencil hardness.

Surface Resistivity

The surface resistivity was measured with a “Resistivity Meter MCP-HT260,” manufactured by Mitsubishi Chemical Corporation each time each ofthe layers was formed.

TABLE 1 Evaluation Surface resistivity, Ω/□ Total light Pencil item 1stlayer 2nd layer 2nd layer * transmittance, % hardness Ex. 1 2 × 10⁷ 2 ×10¹² 2 × 10¹⁴ 90.8 5/5 Ex. 2 2 × 10⁷ 2 × 10⁷ 5 × 10¹³ 90.4 5/5 Ex. 3 6 ×10¹ 3 × 10² 4 × 10¹³ 90.1 5/5 Ex. 4 2 × 10⁷ 2 × 10⁷ 5 × 10¹³ 89.8 5/5Ex. 5 2 × 10⁷ 3 × 10⁷ 6 × 10¹³ 89.3 5/5 Ex. 6 2 × 10⁷ 2 × 10⁷ 6 × 10¹³90.1 5/5 Ex. 7 2 × 10⁷ 3 × 10⁷ 5 × 10¹³ 90.3 5/5 Com. Ex. 1 2 × 10¹⁴ — —90.2 5/5 Com. Ex. 2 5 × 10⁶ — — 64.7 0/5 Com. Ex. 3 2 × 10¹⁴ 4 × 10⁸ 2 ×10⁷ 88.6 0/5 Com. Ex. 4 2 × 10⁷ 3 × 10¹³ >10¹⁴ 89.6 5/5

According to the antistatic hard coat film of the present invention, aconductive layer, which does not inhibit the total light transmittancealthough the scratch resistance is poor, is provided on a substratefilm, and an anisotropic conductive hard coat having excellent scratchresistance, preferably containing gold- and/or nickel-treated particlesas conductive fine particles, is provided on the conductive layer. Byvirtue of this construction, the antistatic hard coat film as a wholehas low surface resistivity and at the same time possesses excellentscratch resistance.

What is claimed is:
 1. An antistatic hard coat film comprising: a transparent substrate film; a transparent conductive layer provided on the transparent substrate film; and a hard coat layer provided on the transparent conductive layer, the transparent conductive layer having a surface resistivity of not more than 10¹² Ω/□, the hard coat layer comprising an anisotropic conductive layer having a surface resistivity of not more than 10¹³ Ω/□ provided that the resistivity is measured when the hard coat layer is formed on the transparent conductive layer.
 2. The antistatic hard coat film according to claim 1, wherein the hard coat layer has a higher resistivity in a layer surface direction and a lower resistivity in a layer thickness direction.
 3. The antistatic hard coat film according to claim 1, wherein the hard coat layer has a volume resistivity in a layer thickness direction of not more than 10⁸ Ω cm.
 4. The antistatic hard coat film according to claim 1, wherein the hard coat layer has a surface resistivity in a layer surface direction of not more than 10¹² Ω/□.
 5. The antistatic hard coat film according to claim 1, wherein the hard coat layer comprises a hard coat resin comprising conductive fine particle, a diameter of the conductive fine particles being not less than one-third of a coating thickness of the antisotropic conductive layer. 